The Job Auction Country


Share On

This listing has Ended
Go to My Listings

Program Manager, IC Packaging Development 
(Job)

adzuna-us  |  United States  |  

Ref:
ADZUNA-US-HIN0F
Direct:
Employer:
Location:
United StatesN 3rd St, AZ, 85004
Category:
Engineering/Engineering
Work Type:
Permanent
Work Time:
Full Time
Tags:
job,united-states,adzuna

Description 

RESPONSIBILITIES: Kforce has a client, a growing international company in the Phoenix, Arizona (AZ) metro area is seeking a Program Manager, IC Packaging Development.

We are working with the Hiring Authority Drive and coordinate development activities with customers and development teams program management for development of advanced fine line modules and other IC package constructions for computing, networking and PC client market spaces.

Summary: This person will be the primary interface with top customers Lead Tier1 customer interface meetings, discussions and follow-ups during project development Coordinate and collaborate with all company resources as are required to execute R&D projects that will exceed all customer requirements Manage cross functional teams comprised of design center and characterization resources to optimize novel designs and to establish design rules for new IC package families Manage product management through initial production ramp REQUIREMENTS: 8-12 years of experience in semiconductor packaging development is required Bachelor's degree in Engineering (Mechanical, Chemical, or Materials Science); Master's degree is preferred Strong understanding of the IC package design environment, and tradeoffs associated with package design during package process development Deep knowledge of IC packaging materials, failure mode and reliability qualification procedures is required Direct previous product management experience involving off-shore process development is highly desired Excellent written and verbal communication skills needed Ability to work independently in a global organization This position requires domestic and international travel (about 20%) Working knowledge of IC IO drivers and associated electrical interactions and trade-offs with different IC packaging technologies desired Knowledge of thermal or mechanical simulations and modeling is desired Familiarity with Design of Experiments and Statistical Process Control and adeptness with the creation of product marketing collateral is a plus Kforce is an Equal Opportunity/Affirmative Action Employer.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.